20192019

Publications in 2019

Journal Papers

[7]
E. Steinbach, M. Strese, M. Eid, X. Liu, A. Bhardwaj, Q. Liu, X. Liu, T. Mahmoodi, R. Hassen, A. El Saddik,
Haptic Codecs for the Tactile Internet,
Proceedings of the IEEE, Special Issue on Tactile Internet, accepted for publication, vol. 197, no. 2, pp. 447-470, February 2019.
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[6]
O. Holland, E. Steinbach, V. Prasad, Q. Liu, Z. Dawy, A. Aijaz, N. Pappas, K. Chandra, V. Rao, S. Oteafy, M. Eid, M. Luden, A. Bhardwaj, X. Liu, J. Sachs, J. Araujo,
The IEEE 1918.1 Tactile Internet Standards Working Group and its Standards,
Proceedings of the IEEE, vol. 107, no. 2, pp. 256-279, February 2019.
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[5]
J. Sachs, L. Andersson, J. Araújo, C. Curescu, J. Lundsjö, G. Rune, E. Steinbach, G. Wikström,
Adaptive 5G Low-Latency Communication for Tactile Internet Services,
Proceedings of the IEEE, accepted for publication, vol. 107, no. 2, pp. 325 - 349, February 2019.
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[4]
D. Van Opdenbosch, E. Steinbach,
Collaborative Visual SLAM using Compressed Feature Exchange,
IEEE Robotics and Automation Letters (RAL), vol. 4, no. 1, pp. 57-64, January 2019.
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[3]
M. Strese, R. Hassen, A. Noll, E. Steinbach,
A Tactile Computer Mouse for the Display of Surface Material Properties,
IEEE Transactions on Haptics, vol. 12, no. 1, pp. 18-33, January 2019.
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[2]
T. Aykut, J. Xu, E. Steinbach,
Realtime 3D 360-degree Telepresence with Deep-learning-based Head-motion Prediction,
IEEE Journal on Emerging and Selected Topics in Circuits and Systems, pp. 1-14, 2019.
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[1]
J. Zou, C. Li, C. Zhai, H. Xiong, E. Steinbach,
Joint Pricing and Cache Placement for Video Caching: A Game Theoretic Approach,
IEEE Journal on Selected Areas in Communication, Special Issue on Multimedia Economics for Future Networks: Theory, Methods, and Applications, accepted for publication, 2019.
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Papers in Conference Proceedings

[4]
X. Xu, Q. Liu, E. Steinbach,
Haptic Data Reduction for Time-delayed Teleoperation Using the Input-to-State Stability Approach,
IEEE World Haptics Conference, Tokyo, Japan, July 2019.
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[3]
X. Xu, E. Steinbach,
Elimination of Cross-dimensional Artifacts in the Multi-Dof Time Domain Passivity Approach for Time-delayed Teleoperation with Haptic Feedback,
IEEE World Haptics Conference, Tokyo, Japan, July 2019.
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[2]
A. Zayets, M. Bourguiba, E. Steinbach,
3D Reconstruction of Indoor Geometry using Electromagnetic Multipath Fingerprints,
IEEE International Conference on Communications , May 2019.
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[1]
A. Hanel, P. Sudi, S. Pfenninger, E. Steinbach, U. Stilla,
Filter-based pose estimation for electric vehicles relative to a ground-based charging platform using on-board camera images ,
Dreiländertagung Photogrammetrie, Fernerkundung und Geoinformation der DGPF, der OVG und der SGPF, Vienna, Austria, February 2019.
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